Newer nonvolatile memory (NVM) technologies are poised to take over from flash in embedded applications on newer process ...

Intel’s expansion; Cadence AI super agent for PCB, advanced packaging; photonics fab wars; earlier Yongin fab; German funding; new CHIPS Act award; HBM standard; Quadric funding; AMS acquisition; ...

AI opens the door to exploring a much larger solution space, similar to what high-level synthesis did years ago, but ...

Hybrid bonding already works in production, but finer-pitch die-to-wafer integration must preserve fab-level surface and ...

An Industry 4.0 technology roadmap for semiconductor device makers that covers carbon emissions, water, and hazardous waste.

A realistic virtual model uncovers the impact of rounded corners on sensitivity to overlay-induced resistance.

Moving from large language models in the cloud to small language models at the edge is much more complicated than just slimming down the algorithms. It requires changes in both hardware and software, ...

Researchers from Georgia Institute of Technology published a technical paper titled “Open DRAM Model—Part II: Enabling ...

Investors kept pouring money into AI hardware startups in the second quarter of 2026. While companies focused on chips for AI data centers have largely dominated the funding over the past year, ...

As the semiconductor ecosystem pivots to AI, it is transforming how IP is created, verified, managed, and sold.

In what has become a yearly custom, I recently spoke to Jay Vleeschhouwer, Managing Director of Griffin Securities, for an update on his view of the state of the electronic design automation (EDA) ...

AI is rocketing ahead. It is the biggest industrial revolution of our age. AI adoption is growing, but still most are at ...