Massive rounds for AI, EDA, and manufacturing; 80 startups raise $8.4B.

Panel-level packaging is arriving not because the engineering is ready, but because wafer-level economics are breaking down.

A new technical paper, “Exploring Silent Data Corruption as a Reliability Challenge in LLM Training,” was published by ...

Large systems companies are pressing EDA vendors for performance improvements to keep pace with their AI workflows. The ...

Die-to-die chiplet standards are only the beginning. Many more standards are necessary for a chiplet marketplace. A number of such standards have either had initial versions released or are in ...

There is no doubt that the semiconductor industry is in an era of rapid and profound transformation, driven by an increasing ...

Achieving energy-efficient AI systems will require pre-competitive, industry-wide collaboration on foundational capabilities.

As DRAM technologies scale to increasingly tighter pitches, the patterning requirements exceed the limits of conventional ...

AI workloads are driving their adoption in data centers. On the other hand, photonic interconnects require a variety of ...

Combining GaN transistors with silicon-based digital circuits enables complex computing functions built directly into power ...

Fine-tuning TCAD parameters with real-world feedback from test wafers is essential for quantitatively accurate and predictive results.

The relentless march of semiconductor scaling continues to reshape the packaging landscape, driven by Moore’s Law and the ...