China low activation martensitic (CLAM) steel, as a typical reduced activation ferritic/martensitic steel, is the main candidate structural material for fusion reactors due to its low activation, high ...

An evaluation of a negative-tone i-line photosensitive polymeric bonding material for achieving prebonding in Cu/polymer hybrid bonding at low temperatures via the Cu damascene process. The polymeric ...

As high-bandwidth memory (HBM) moves to taller stacks with denser chip-to-chip I/O connections, thermal compression bonding (TC bonder) technology is hitting bottlenecks. Hanwha Semitech aims to ...

Hanmi Semiconductor has begun mass production of its thermal compression bonder (TCB) for HBM4, targeting the rapidly expanding high bandwidth memory market driven by AI workloads. But its delayed ...