As manufactures add more and more features to mobile devices like MIDs and smartphones we need more and more powerful processors to handle the extra workload. Texas Instruments has unveiled a new ...
The OMAP3530 CUS package is designed with a new technology called Via Channel™ array. This technology allows for easy routing of the device in two signal and two power layers using standard 20 mil ...
Giving designers more performance to run new application features and additional headroom to add their own IP, Texas Instruments Incorporated (TI) (NYSE: TXN) today announced a speed upgrade for the ...
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