Multi-die assemblies greatly increase the number of things that can go wrong, and the difficulty of finding them.

The move to multi-die packaging is driving chipmakers to develop more cost-effective ways to ensure only known-good die are integrated into packages, because the price of failure is significantly ...

Board-level and semiconductor test data are often analyzed separately, limiting correlation across the product lifecycle. Linking PCB assembly (PCBA) test results, including in-circuit and functional ...

Environmental and qualification testing play a critical role in this process. As device geometries shrink and packaging technologies become more complex, environmental stress testing provides a ...