Taiwan Semiconductor Manufacturing Co. plans to expand its chip-making capacity with two additional facilities to help meet demand related to artificial intelligence. The government for the southern ...

TSMC's upcoming CoPoS packaging technology could reduce chip costs while improving AI performance, with mass production reportedly targeted for 2028. The Latest Tech News, Delivered to Your Inbox ...

Taiwan's TSMC will build two additional advanced chip packaging plants in Chiayi Science Park, aiming to meet surging demand ...

By Wen-Yee Lee TAIPEI, July 13 (Reuters) - Taiwan Semiconductor Manufacturing Co (TSMC) will add two advanced chip packaging ...

Wave of Taiwanese packaging and test companies, namely ASE, SPIL, Powertech, and KYEC, are taking advantage of the situation ...

The chip manufacturing industry can be quite complex, and that’s normal. After all, there are multiple factors that go into the performance of a SoC, making it a success or directly ruining a good ...

Shares in JCET Group continued to surge after China's largest semiconductor packaging and testing provider said it plans to invest more than $1 billion to boost its advanced chip-packaging capacity.

Sixteen miles north of Albuquerque, in Rio Rancho, New Mexico, an Intel chip plant sits on more than 200 acres of land. The site was established in the 1980s, part of it built on top of a sod farm. In ...

The proposed funding, part of the CHIPS Act, is intended to stoke chip packaging, a process that helps drive progress in semiconductors but that takes place mostly in Asia. By Don Clark Reporting from ...

As artificial intelligence pushes semiconductor performance to new limits, chipmakers are increasingly turning to advanced packaging to overcome challenges that traditional chip design alone can no ...

A s part of the CHIPS for America program, the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, ...