Backside power delivery is being called a game changer — a breakthrough technology and the next great enabler in CMOS scaling. It promises significant PPA advances, including faster switching, lower ...
Backside power delivery reduces routing congestion at the most advanced nodes and offers significant performance improvement options. But it also adds a bunch of new challenges involving via alignment ...
(a) Integration schematic of an n-TSV in BSPDN architecture; (b) high-AR n-TSV array configuration; (c) calculated thermal stress mappings in n-TSVs with (i) vertical and (ii) tapered sidewalls.
Some results have been hidden because they may be inaccessible to you
Show inaccessible results